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11	Trusted Integrated Chips (TIC) Safe and Secure Operations Office Dennis L. Polla, Ph.D. Acting Director SSO TIC Proposers’ Day Add to Reading List Source URL: www.iarpa.gov Language: English - Date: 2014-03-06 18:49:41 Technology Integrated circuits Electronics manufacturing Intelligence Advanced Research Projects Activity Logic families Back end of line CMOS Front end of line Application-specific integrated circuit Semiconductor device fabrication Electronic engineering Electronics
12	3D IC WORKING GROUP MEETING JULY 17, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronic engineering Computer memory Technology Fabless semiconductor companies Three-dimensional integrated circuit Back end of line Rambus Dynamic random-access memory Interposer Semiconductor device fabrication Electronics Integrated circuits
13	A Comparison of 3D Package Designs: Traditional Organic Substrates and Advanced Silicon Interposers GSA 3DIC Stacking Working Group Meeting July 17, 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:15 Integrated circuits Electronic engineering Technology Fabless semiconductor companies Rambus Three-dimensional integrated circuit Dynamic random-access memory Interposer Back end of line Computer memory Electronics Semiconductor device fabrication
14	Next-generation Key CMOS Technologies R&D of LSIs Aiming at High Reliability, High Performance and Low Power Consumption HAYASHI Yoshihiro Abstract Add to Reading List Source URL: www.nec.com Language: English - Date: 2012-09-11 09:28:27 Integrated circuits Logic families Semiconductor device fabrication MOSFET CMOS Back end of line Electronic engineering Electronics Digital electronics
15	Micro Technologies For more information on partnering with the Kansas City Plant, contact: Ofﬁce of Business Development Add to Reading List Source URL: honeywell.com Language: English - Date: 2012-04-26 07:29:47 Electromagnetism Microelectromechanical systems LIGA Semiconductor device fabrication Vertical-cavity surface-emitting laser Integrated circuit Back end of line Electronic packaging Technology Microtechnology Materials science
16	F R A U N H O F E R I n s t i t u t e for E l e c t roni c N ano S y s t e m s E N A S Back-End of line 1 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 07:05:47 Thin film deposition Emerging technologies Semiconductor device fabrication Microtechnology Microelectromechanical systems Atomic layer deposition Carbon nanotube Chemical vapor deposition Thin film Technology Materials science Chemistry
17	3D INTEGRATION: TSV PROCESSES AND WAFER THINNING 1 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 16:05:10 Technology Deep reactive-ion etching Microelectromechanical systems Etching Wafer Applied Materials Thermal oxidation Back end of line Photoresist Semiconductor device fabrication Materials science Microtechnology
18	Fraunhofer IPMS Center Nanoelectronic Technologies (CNT) Equipment & Capabilities for 200 & 300 mm www.cnt.fraunhofer.de Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2015-01-15 15:06:10 Technology Back end of line Etching Front end of line Applied Materials KLA Tencor Amorphous silicon Wafer CMOS Semiconductor device fabrication Electronics Electronic engineering
19	Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-27 18:47:55 Microtechnology Chemical-mechanical planarization Etching Back end of line Copper interconnect Through-silicon via Wafer Chemical vapor deposition Three-dimensional integrated circuit Semiconductor device fabrication Electronics Technology
20	1 Assembly and Packaging Difficult Challenges Difficult Challenges[removed]Summary of Issues Add to Reading List Source URL: public.itrs.net Language: English - Date: 2014-03-31 09:28:23 Microtechnology Wafer Back end of line Microelectromechanical systems Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array Semiconductor device fabrication Electronics Technology

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